BS EN 61188-5-5-2007 印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件
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【英文标准名称】:Printedboardsandprintedboardassemblies-Designanduse-Attachment(land/joint)considerations-Componentswithgull-wingleadsonfoursides
【原文标准名称】:印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件
【标准号】:BSEN61188-5-5-2007
【标准状态】:现行
【国别】:英国
【发布日期】:2007-12-31
【实施或试行日期】:2007-12-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:应用;组件;芯片;连接件;设计;开发;尺寸;分立器件;电气工程;电子工程;电子设备;电子设备及元件;架设(施工作业);几何;翅形引线;制造;安装;包装件;印制电路;印制电路板;耐力;表面安装设备;软钎焊连接;软钎焊;软钎焊工艺;规范(验收);结构体系;辅助框架;表面安装;表面安装装置;终端区域;测试;公差(测量)
【英文主题词】:Applications;Assemblies;Chips;Components;Connections;Design;Developments;Dimensions;Discretedevices;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Erecting(constructionoperation);Geometry;Gull-wing-leads;Landpattern;Manufacturing;Mounting;Packages;Printedcircuits;Printed-circuitboards;Resistance;SMD;Solderedjoints;Soldering;Solderingprocesses;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Surfacemountingdevices;Terminalareas;Testing;Tolerances(measurement)
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithgull-wingleadsonfoursides.Theintentoftheinformationpresentedhereinistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternstoensuresufficientareafortheappropriatesolderfillet,andalsoallowforinspection,testingandreworkingofthosesolderjoints.Eachclausecontainsaspecificsetofcriteriasuchthattheinformationpresentedisconsistent,providinginformationonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.Thelandpatterndimensionsarebasedonamathematicalmodelthatestablishesaplatformforasolderjointattachmenttotheprintedboard.Theexistingmodelscreateaplatformthatiscapableofestablishingareliablesolderalloyusedtomakethatjoint(lead-free,tinlead,etc.).Processrequirementsforsolderreflowaredifferentbasedonthesolderalloyandshouldbeanalyzedinorderthattheprocessisabovethattemperatureasufficienttimetoformareliablemetallurgicalbond.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:46P;A4
【正文语种】:英语
【原文标准名称】:印制电路板和印制电路板组件.设计和使用.第5-5部分:焊接(焊接区/焊缝)考虑.四面带有翅形引线的部件
【标准号】:BSEN61188-5-5-2007
【标准状态】:现行
【国别】:英国
【发布日期】:2007-12-31
【实施或试行日期】:2007-12-31
【发布单位】:英国标准学会(GB-BSI)
【起草单位】:BSI
【标准类型】:()
【标准水平】:()
【中文主题词】:应用;组件;芯片;连接件;设计;开发;尺寸;分立器件;电气工程;电子工程;电子设备;电子设备及元件;架设(施工作业);几何;翅形引线;制造;安装;包装件;印制电路;印制电路板;耐力;表面安装设备;软钎焊连接;软钎焊;软钎焊工艺;规范(验收);结构体系;辅助框架;表面安装;表面安装装置;终端区域;测试;公差(测量)
【英文主题词】:Applications;Assemblies;Chips;Components;Connections;Design;Developments;Dimensions;Discretedevices;Electricalengineering;Electronicengineering;Electronicequipment;Electronicequipmentandcomponents;Erecting(constructionoperation);Geometry;Gull-wing-leads;Landpattern;Manufacturing;Mounting;Packages;Printedcircuits;Printed-circuitboards;Resistance;SMD;Solderedjoints;Soldering;Solderingprocesses;Specification(approval);Structuralsystems;Subracks;Surfacemounting;Surfacemountingdevices;Terminalareas;Testing;Tolerances(measurement)
【摘要】:ThispartofIEC61188providesinformationonlandpatterngeometriesusedforthesurfaceattachmentofelectroniccomponentswithgull-wingleadsonfoursides.Theintentoftheinformationpresentedhereinistoprovidetheappropriatesize,shapeandtolerancesofsurfacemountlandpatternstoensuresufficientareafortheappropriatesolderfillet,andalsoallowforinspection,testingandreworkingofthosesolderjoints.Eachclausecontainsaspecificsetofcriteriasuchthattheinformationpresentedisconsistent,providinginformationonthecomponent,thecomponentdimensions,thesolderjointdesignandthelandpatterndimensions.Thelandpatterndimensionsarebasedonamathematicalmodelthatestablishesaplatformforasolderjointattachmenttotheprintedboard.Theexistingmodelscreateaplatformthatiscapableofestablishingareliablesolderalloyusedtomakethatjoint(lead-free,tinlead,etc.).Processrequirementsforsolderreflowaredifferentbasedonthesolderalloyandshouldbeanalyzedinorderthattheprocessisabovethattemperatureasufficienttimetoformareliablemetallurgicalbond.
【中国标准分类号】:L30
【国际标准分类号】:31_180
【页数】:46P;A4
【正文语种】:英语
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